1、SMT PROCESS SPECIFICATION CONTENTS1SHIPPING, STORAGE and PRODUCTION ENVIRONMENT41.1General41.2General shipping and storage conditions51.3Storage and handling conditions for solder paste61.4Storage and handling conditions for printed wiring boards PWBs61.5Storage conditions for underfill epoxy materi
2、als71.6Shelf life time for different component categories81.6.1Expired material handling81.7Moisture sensitivity levels81.8Drying (baking) moisture sensitive devices91.8.1Drying (baking) restrictions91.9DRY STORAGE CONDITIONS102STENCIL PRINTING PROCESS SPECIFICATIONS112.1Paste specification112.2Sque
3、egee122.3Stencil122.4Support tables132.5Printing process parameters (stencil printing)132.6Print result validation143Process control and monitoring153.1Automated Optical Inspection, AOI153.2Location of the machine in the production line153.3Utilization of inspection results153.4Component and paste a
4、larm limits163.5Specification limits for capability analyses174PLACEMENT PROCESS SPECIFICATIONS184.1Nozzles184.2Feeders184.3NC-Programs184.4Part Data / Vision processing194.5Placement process management data compatibility table195Dipping process205.1Dipping flux specification and handling instructio
5、ns205.1.1Storage and handling instructions205.1.2Flux specifications205.2Dipping process specifications215.2.1Dipping device215.2.2Dipping process parameters216Reflow soldering profile measurement226.1Profile measurement equipment226.2Reflow profile measurement method with standard calibration board
6、227Standard, lead containing soldering process237.1.1Recommended reflow oven settings248Lead free soldering process258.1Reflow profile definition for Pb-free process258.2General Pb-free reflow soldering profile specification268.3Basic profile specification for standard calibration board in Pb-free p
7、rocess278.4Start-up settings for Pb-free process298.5Reflow profile measurement on product PWBs309UnderfiLl process319.1General3110NK ACA SMT Process Specification3310.1ACA Technology Introduction3310.2ACA Process3310.3Anisotropic Conductive Film3510.3.1ACF Material Specification3510.3.2ACA Process
8、Parameters3610.3.3Cooplanarity measurement3710.3.4Measurement of bond line temperature3710.3.5Interposer3810.4ACA Storage Conditions3810.5Interconnection Area Designing for Hitachi Chemical AC-2056T-45 ACF3910.6Bonding Force Calculation4011MANUAL SOLDERING PROCESS AND WORKMANSHIP CRITERIA4112Specifi
9、cations for visual inspection; error criteria, faults classification and training material4113Related Documents411 SHIPPING, STORAGE AND PRODUCTION ENVIRONMENT1.1 GeneralGlobal NK Workplace Resources (NWR) organization specifies and takes care of general environmental conditions in material storage
10、and factory hall, containing:-heating-ventilation-air conditioning-water/sewage-fire extinguishing systems-cooling-special HVAC (vacuum, soldering exhaust etc.)-electrical & ESD protectionSpecial process related matters like local machine/process step related filtering, lightning; AC and ESD protect
11、ion should be take care by Time Zones and factories. Environmental conditions should be continuously monitored. Longer than four hour weighted average out-of-specification situations should trigger corrective actions.If tighter conditions are required or if these specifications/limits cant be remain
12、 local air conditioning (AC) systems like cooler/heater and laminar flow cabins must be used.More detailed and up-to-date environmental specifications can be found from Global NK Workplace Resources Intranet pages. 1.2 General shipping and storage conditions Expected shipping conditions (components
13、and materials) 1Relative humidityRH 15 % - 70%Temperature -5C.+40CGeneral NK Storage conditions 2Relative humidityRH 10%-70%TemperatureTemperature 15C - 30C 3Component packing levelComponents must be at least in the first level, so called intimate delivery packing:- MBB (Moisture Barrier Bag) for hu
14、midity sensitive components- ESD (Electro Static Discharge) protective packing- Air flow preventive plastic packing (vacuum or not, but tightly closed)- Cardboard box if nothing of above mentioned packing are usedGeneral storage requirements Materials are not allowed to be stored:- in direct sun shi
15、ne, not even through windows- close to heater/cooler/humidifier/light source- close to outdoors so that temperature/humidity limits are repeatedly exceeded NK production conditionsRelative humidity35%-55%Temperature20.5C 26.5C1 External environment. Materials should be packed so that special requirements like maximum temperatures for underfill epoxy is not exceeded. Solder paste has its own specified shipping condition.
